Utpal Roy

Professor

Mechanical and Aerospace Engineering

231 Link Hall

uroy@syr.edu

315.443.2592

Degree(s):

  • Ph.D., Purdue University

Research Interests:

  • Geometric tolerances
  • Solid modeling
  • Computer aided design and manufacturing
  • Intelligent CAD
  • Product design/Design & manufacturing
  • Sustainable manufacturing
  • Application of artificial intelligence

Teaching Interests:

  • CAD/CAM systems
  • Design for manufacturing

Honors:

  • Received the FIRST L. C. SMITH Award for Faculty Excellence, 2008
  • Selected as an Associate Editor for the International Journal of Product Development from 2004
  • Selected as an Associate Editor for the SME’s Journal of Manufacturing Systems (JMS) from 2001-2004
  • 1993 Pi Tau Sigma Outstanding Professor in Mechanical Engineering Award

Select Publications:

“Enriching STEP Product Model with GD & T Information for 1-D Tolerance Analysis”, M. I. Sarigecili, U. Roy and S. Rachuri, the ASME Trans., The ASME Journal of Computing and Information Science in Engineering (In press)

“Ontology-based Disassembly Information System for Enhancing Disassembly Planning and Design,” Bicheng Zhu and Utpal Roy, the International Journal of Advanced Manufacturing Technology, DOI 10.1007/s00170-014-6704-8, Jan 15, 2015

“Development and Utilization of a Product Information Model for Sustainable Manufacturing,” Heng Zhang, Bicheng Zhu, Omer Yaman and Utpal Roy, the SME Journal of Manufacturing Systems, Vol. 37, pp. 459-466, October 2015

“Information Models for Processing Product Life Cycle Functionalities and Interfaces for Sustainable Manufacturing”, Utpal Roy and Mehmet I. Sarigecili, the ASME Transactions, the ASME Journal of Computing and Information Science in Engineering, March, 2016, Vol. 16, pp. 011005-1 to 011005-11

“A Novel Use of Geo-solar Energy and Storage Technology (GEST) in Existing Housing Applications: A Conceptual Study,” Lowell E. Lingo, Jr. and Utpal Roy, submitted for publication in the ASCE Journal of Energy Engineering, May 10, 2016 (the direct link to the paper’s page: http://ascelibrary.org/doi/abs/10.1061/%28ASCE%29EY.1943-7897.0000271

“Design for Implementation Strategy for Designing a Sustainable Building Using the Geosolar Exergy Storage Technology (GEST): A Case Study,” Lowell E. Lingo, Jr. and Utpal Roy, ASCE Journal of Energy Engineering.

“Development of the Integrated Product Information Model for Product Sustainability Assessment,” U. Roy, M.M. Baysal, M.I. Sarigecili, M. Shuaib, Fazleena Badurdeen and I.S. Jawahir, International Journal of Sustainable Manufacturing, Vol. 3, No. 2, 2014.

“A Multi-Objective Optimization Methodology Towards Product Design for Sustainability,” Yunpeng Li and Utpal Roy, IJSEAM Special Issue in Sustainable Manufacturing (in press)

“Interpreting the Semantics of GD & T Specifications of a Product for Tolerance Analysis,” Mehmet I. Sarigecili, Utpal Roy and Sudarsan Rachuri, Computer-Aided Design, Vol. 47, pp. 72-84, 2014

“A Ground-Coupled Wall System for New and Existing Structures,” the American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE) Trans., DA-13-004

“Disassembly Information Model Incorporating Dynamic Capabilities for Disassembly Sequence Generation,” Bicheng Zhu, Mehmet I. Sarigecili and Utpal Roy, Int. Journal of Robotics and Computer Integrated Manufacturing, Vol. 29, No. 5, pp. 396-409, 2013

“A Disassembly Process Model for End-of-Life Activities of Manufactured Products, ” Mehmet Sarigecili, M. M. Baysal, B. Zhu and Utpal Roy, International Journal of Sustainable Manufacturing, Vol. 3, No.1, pp. 37-56, 2013

“Energy Management Between a Building Envelope and its Environment for Residential HVAC,” Lowell E. Lingo and Utpal Roy, ASCE Journal of Energy Engineering (in press; already available in electronic format, 10.1061/(ASCE)EY.1943-7897.0000149 , 04013023. , 2013.)

“A Multi-Objective Optimization Methodology Towards Product Design for Sustainability,” Yunpeng Li and Utpal Roy, IJSEAM Special Issue in Sustainable Manufacturing

“Role of Behavioral Analysis in the Product Repair and Replacement Process: the Preliminaries,” Utpal Roy and Lowell E. Lingo, Jr., International Journal of Sustainable Manufacturing, Vol. 3, No. 1, pp. 74 – 93, 2013

“A Ground-Coupled Wall System for New and Existing Structures,” Lowell E. Lingo and Utpal Roy, American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASRAE) Transc., 2012

“Disassembly Process Model for End-of-Life (EOL) Activities for Manufactured Products,” Mehmet I. Sarigecili, Mehmet M. Baysal, Bicheng Zhu. and Utpal Roy, International Journal of Advanced Manufacturing Technology, 2012

“Disassembly Information Model Incorporating Dynamic Capabilities for Disassembly Sequence Generation,” Bicheng Zhu, Mehmet I. Sarigecili, and Utpal Roy, Robotics and Computer Integrated Manufacturing, 2012